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Working With WIN Enterprises |
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| WIN Enterprises strives for long-term business relationships with its customers. In approaching WIN, remember all of our COTS designs can be further modified to meet your more exact requirements when ordered in sufficient quantities. Our products are designed for long life cycles using embedded components. We are capable of designing entire product lines across a variety of performance parameters. |
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| Our flexibility in meeting custom requirements is a major differentiator for WIN in the embedded market. We consult with customers to arrive at a thoughtful recommendation for the best-fit evaluation platform. After the evaluation phase, WIN can modify the design based on exact feature requirements. We also work with customers to develop completely new designs, which we also manufacture, test, and drop ship. |
Embedded Development Kits
A robust set of Development Kits based on the experience of hundreds of successful designs across a breadth of different applications provides you with quick time-to-market with a unique solution that differentiates you in your market.
WIN maintains core design modules in the following application areas:
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Networking & Network Security
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Internet Appliances
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Mobile/intense computing
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Telecommunications
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Industrial PC / Industrial Automation
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Transaction Terminals / POS Systems
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Gaming/Entertainment/Digital Home
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Medical Devices/Scientific Instrumentation
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Transportation/Automotive
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Military/Aerospace/ Law Enforcement
System Definition Phase
System definition is the most critical phase in manufacturing projects. The functionality and performance of a product are defined within this stage. This becomes the basis for determining your product’s specifications. In this phase WIN will help:
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Define the product’s objectives and functionality of each product part
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Explore alternatives for components, considering availability, reliability, and longevity
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Propose a custom solution if an off-the-shelf solution does not exist
Electronic Design / Product Development
WIN's engineering team maximizes performance while minimizing development time and overhead costs. We draw upon years of knowledge and experience to produce your customized motherboard or appliances.
Every day WIN's engineers are setting new standards for performance, reliability, and value.
During the design/development phase WIN will:
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Develop the product design
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Explore the various options available
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Develop a technology roadmap that will be used in the final phase of development
Embedded X86 Design Process
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Project Plan
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Statement of Work
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Develop Final Specification
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Review Engineering Specification
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Release Final Specification
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Develop Final Block Diagram
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Customer Review
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Accept Final Block Diagram
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Develop Schematics
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Provide Complete Mechanical Specifications
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Pre-Route A) Signal Integrity Analysis B) Review Specifications C) Support Stack-Up Selection D) Develop Routing Rules E) Develop Pre-Routing Simulations F) Review and Cleanse Models
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Develop Bill of Materials (BOM)
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Design Review
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Accept Schematics
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Component Placement and Mechanicals
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Baseline Thermal Model A) Develop Baseline Thermal Profile B) Review Worst Case Voltages and Power C) Review Air Flow Strategy
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Design Review
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Accept Placement
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Final Thermal Simulation
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Procure Long-Lead Items for Prototypes
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Routing
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Support Routing Effort
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Cross-Reference Design Guides
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Electrical Simulation (post-route) A) Trace Length / Impedance Analysis B) Signal Integrity C) Cross Talk Screening D) Split Plane Discontinuity Analysis
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Deliver Design Files
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Final Design Review
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Accept Final Design
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PCB Manufacture
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Develop Mechanical Samples
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Assemble Prototypes
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Board Testing
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Engineering Validation
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Customer-Specific Testing A) Application Testing B) Certifications C) HALT/HASS D) MTBF/ORT
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34) Deliver Working Prototypes to Customer
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35) Release
Design Validation Process
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WIN adheres stringently to the design guides of its customers, notably Intel and AMD
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Customer Design Guides
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Post-Route Simulation A) Trace Length / Impedance Analysis B) Signal Integrity C) Crosstalk Screening D) Split Plane Discontinuity Analysis
Engineering Validation Process
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Functional Testing & Specification Verification
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Voltage Margin Testing & Analysis
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Temperature Margin Testing & Analysis A) Develop Baseline Thermal Profile B) Review Worst Case Voltages and Power C) Review Air Flow Strategy D) Perform Final Simulation E) Thermal Analysis Tool: FloTherm
Signal Integrity Analysis: Pre-Route
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Review Specifications
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Support Stack-Up Selection
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Develop Routing Rules
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Develop Pre-Route Simulations
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Review and Cleanse Models
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SI Tools: A) SPECTRAQuest B) Hyperlynx C) HSPICE
Design Validation Process
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Intel Design Guides
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Customer Design Guides
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Post-Route Simulation A) Trace Length / Impedance Analysis B) Signal Integrity C) Crosstalk Screening D) Split Plane Discontinuity Analysis
Engineering Validation Process
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Functional Testing & Specification Verification
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Voltage Margin Testing & Analysis
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Temperature Margin Testing & Analysis A) Develop Baseline Thermal Profile B) Review Worst Case Voltages and Power C) Review Air Flow Strategy D) Perform Final Simulation E) Thermal Analysis Tool: FloTherm
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