WIN Enterprises Announces COM Express Module with 6th Generation Intel® Core i7/i5/i3 Processors



Front and Back Views, MB-73430

NORTH ANDOVER, MA, March 8, 2016: WIN Enterprises, Inc., a leading manufacturer of embedded controllers and network platforms for OEMs, announces the MB-73430 a basic-size COM Express module. MB-73430 features Type 6 pin-outs. The unit is unique because it supports a wide range of the new Intel® 6th Generation Core™ i7/i5/i3 SoC processors, considered by Intel one of their best-ever processors for delivering high performance, with low power usage and superior graphics support.


  • • 6th Generation Intel® Core™ i7/i5/i3 processors
  • Three DDI channels, one LVDS
  • Supports up to 3 independent displays
  • Intel® Gen9 HD Graphics with HEVC (H.265) support up to 32GByte dual channel DDR4 memory
  • Supports 8 PCIex1 Gen 3
  • Enables a wide range of voltage inputs

This 6th generation Intel processor family (formerly Skylake) is packed with advanced features that boost productivity in areas like 3D gaming, factory automation, and counter and cart-based medical applications. The high performance of the new processors supports fluid video streaming to open up new possibilities in training, visualization, and other data intense applications. COM Express modules are good for all kind of applications, but especially for those systems designed for future upgrading. The challenge with upgradable modules is finding ever more powerful processors to support the OEMs' feature-rich solutions. Today, for instance, that often means a need for superior graphics. This is a requirement in the broad swath of environments that COM Express modules may serve: medical, factory automation, gaming, etc.

The MB-73434 is designed to deliver enhanced HD graphics. In addition to featuring Intel 6th Generation Core™ i7/i5/13 processors, the MB-73430 module has three DDI channels and one LVDS. It supports up to 3 independent displays and supports Intel® Gen9 HD Graphics with HEVC (H.265). The unit enhances high-density streaming applications and optimized 4K video conferencing with HEVC (8-bit), VP8, VP9, and VDENC encoding, decoding, and transcoding. The MB-73434 module provides up to 32GByte dual channel DDR4 memory; and enables a wide range of voltage inputs for environments from mobile, embedded, counter top, and desktop.



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