MB-80100

PICMG 1.3 SHB with Twin Sockets for Intel® Multicore Technology 2x Intel® Nehalem and Westmere (code names) processors, Intel® 5520 Chipset, FireWire, LSI 1068E RAID chip and PCI-X

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Downloads for MB-80100

User Manual Data Sheet
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Features

  • Supports 32- and 64-bit high performance Intel® Multi-Core Technology with Dual Intel Nehalem and Westmere Xeon multi-core processors
  • Supports Intel® Virualization Technology
  • 2x Socket LGA 1366
  • Supports up to 20 Lanes of PCI-Express Gen 2.0: x8, x8 (can be combined to x16), x4 through standard A and B edge fingers
  • Supports MXM-II interface. Validated with ATI Radeon e2400 mobile MXM-II Graphics Card
  • Supports Custom IP-90350 MXM-II Pass Through Card IP-90350 to bridge x16 lanes (configurable to x8/x8) of PCI-Express Gen 2.0 to custom backplanes for expansion
  • Features 6 Non-ECC or ECC Registered DDR3 240 pin slots for Triple Channel Memory to each processor.
  • Individual Power planes (i.e., individual power supply for CPU and Memory)
  • Semi-custom pin-out supports the full range of PCI-X on WIN Enterprises custom backplanes: 33/66/100/133MHz @ both 32-bit and 64-bit rates
  • Dual 1GbE LANs
  • FireWire support through custom card: IP-90279
  • HD Audio Bus (Azalia) Header for custom HD Audio output card (IP-90340)

WIN Enterprises will customize this standard product to your more exacting requirements to provide you with a long-life embedded product that is differentiated in the market.

 

Specifications
CPU

MB-80100 and CPU daughter card feature the Intel® LGA1366 socket with support for 32- and 64-bit high performance computing. Supported are Intel® Multi-Core Technology: Xeon 5500 and 5600 Quad-Core and Hexa-Core Processors in configurations up to 2 Processors and a Maximum TDP support of 95W per CPU.

 

- Processor Details: ARK | Your Source for Intel® Product Information

Chipset Intel 5520 chipset
BIOS AMI
Memory 8GB per DIMM Slot (ECC Registered or Non-ECC)
Hardware Monitoring Supports temperature, fan speed (PWM supported) and voltage monitoring as well as Watchdog Timer to generate software selectable timeouts and system reset.
I/O
LAN Intel 82574L 10/100/1000
COM Dual RS-232 Serial Port Links through onboard headers
USB 4 USB 2.0 Port headers onboard with +2 more If optional FireWire card is used
Video On-Board DVI-I and LVDS ports passes dual-head video signals from optional MXM-II ATI Radeon e2400 mobile graphics card
PCI-Express x16 Lanes PCI-Express Gen 2.0 through A, B Edge connector (configurable to x8/x8)
x4 Lanes PCI-Express Gen 2.0 through A Edge connector
x16 Lanes PCI-Express Gen 2.0 through MXM-II Slot (for Graphics)
FireWire PCI-Based FireWire chip and FireWire adapter cable for high-speed storage data-link
Audio Optional HD Audio (Azalia) header for custom HD Audio Codec adapter (IP-90340)
Storage
SATA 6x SATA-II Ports w/ RAID 0/1 available from ICH 10R Southbridge
PCIe PCIe based LSI 1068E 8x Port SAS Controller
Environmental
Power ATX Power supported through backplane
Temperature Range Operating Temperature 0° to 45° C
Dimensions

13.330in long, 4.976in wide, 3.42in tall (with tallest heatsink)*

13.330in x 4.976in x 2.6326in tall (with shortest heatsink)*      

33.86cm x 12.64cm x 8.681cm (with tallest heatsink)*

33.86 x 12.64 x 6.686cm (with shortest heatsink)*

Ordering Information
MB-8010A PICMG 1.3-Style SBC featuring Socket 1366 for Nehalem and Westmere processors, support for twin Processors, Intel 5520 Chipset, FireWire, LSI chip and PCI-X
Options
IP-90550 5xPCI-e (x16 Mechanical): 1xPCI-X Midplane
IP-90310 5x PCIe:1xPCI-X; MXM PTC Midplane
IP-90320 4xPCIe;MXM PTC Midplane
IP-90430 CPU Card
IP-90340 HD Audio Card
IP-90270 FireWire / USB Card
IP-90350 MXM II Pass Through Card

Sample list of valid processors for MB-80100 (Click CPU Model/Description for links)

MB-80100: BACK SIDE

 

 
WIN ENTERPRISE SERVICES: HARDWARE DESIGN, MANUFACTURING & FULFILLMENT
 
 Notes:
- Two aluminum heatsinks are available for production or evaluation to meet different cooling profiles. For more specific requirements, custom heatsinks with different materials, sizes or weights can be designed. Height includes MXM-II card slot with MXM-II Pass Through Card installed on the bottom of the SHB assembly.
- When making sales inquiries provide quantity, CPU type, bus speed, and memory requirements.
- Specifications subject to change without prior notice.
 
WIN Enterprises, Inc.
300 Willow Street South
North Andover, MA 01845
978-688-2000
sales@win-ent.com
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